CoPoS is a completely new Chip-on-Panel-on-Structure technology from TSMC, which is generally focused on creating ultra-large processors for artificial intelligence and high-performance computing (HPC).

The CoPoS technology could enter mass production in the second half of 2028. Initially, it will be used in the NVIDIA Feynman AI chipset and will improve the cost efficiency of ultra-large packages, the size of which is more than 9.5 times the size of a photomask.